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Silica-polyimide composites fo...
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Silica-polyimide composites for microelectronic packaging.
Bibliographic Details
Main Author:
Reed, David M.
Format:
Thesis
Book
Language:
English
Published:
[Place of publication not identified] :
[publisher not identified],
1991.
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Penn State
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Call Number:
Thesis 1991mReed,DM
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